News Summary:
Elma Electronic recently addressed the critical role of I/O cabling in modern VPX system integration, detailing how increased signal density and high-speed protocols like USB3, DisplayPort, and 10 Gigabit Ethernet require careful consideration of diverse connector types, bend radius, and spatial footprints (June 18, 2026). Previously, on May 26, the company highlighted VNX+ (VITA 90) and QMC (VITA 93) as modular, scalable computing architectures, designed to enable the Modular Open System Approach (MOSA) for autonomous and uncrewed vehicles operating under severe space, weight, and power (SWaP) constraints. This emphasis on VNX+ and QMC followed a webinar invitation on April 27, which offered insights into the application of these standards for SWaP-constrained platforms. Elma also explored packaging and functional considerations for secure mobile communications on April 28, focusing on cloud-native architectures, 5G capabilities, and scalable infrastructure to support ultra-low latency and high throughput. Separately, on April 22, 2026, Elma Electronic AG's Annual General Meeting approved all agenda items and proposals put forward by the Board of Directors by a large majority, with shareholders representing 66.14% of the registered share capital attending.
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