MediaTek recently hired Chen-Hua Douglas Yu, a retiring TSMC R&D leader known as one of the "six knights" and a central figure in advanced packaging development, following his 2025 retirement from TSMC. Earlier on May 2, TSMC detailed its A16 (1.6nm) process technology, initiating its "Angstrom Era," which aims to deliver improved performance/power profiles over its 2nm node by promising a 10% speed boost or a 20% power reduction. This A16 process will incorporate backside power, with production expected by the fourth quarter of 2026, and TSMC plans to present the technology at the 2026 VLSI symposium. Previously on the same day, TSMC paused its purchase of ASML’s newest High-NA EUV lithography machines for its A13 process node, stating that the capability is not yet required for that specific technology.
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