On March 15, 2026, analyses indicated that the spreading Iran conflict in the Gulf is exposing weaknesses in the global semiconductor supply chain, leaving major chip hubs such as Taiwan particularly vulnerable to disruptions in energy transport and critical industrial gases. This development comes as TSMC nears a $2 trillion market capitalization, with a report from Yahoo Finance on the same day noting this growth is fueled by rising demand for artificial intelligence, aligning it with the existing five members of the $2 trillion club. Earlier on March 15, an industry-wide constraint in advanced packaging, specifically chip-on-wafer-on-substrate (CoWoS) technology, was identified as a physical bottleneck determining the total volume of AI accelerators reaching the market, impacting key players like TSMC, Intel, and Samsung.
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