On July 31, 2026, speculation mounted that TSMC, the world's largest foundry, may accelerate its mass production timeline for next-generation 1.4-nanometer (nm) process technology to 2028, a move expected to intensify competition in the global semiconductor market. Concurrently, TSMC is reportedly developing an advanced packaging solution, internally dubbed “EMIB-like,” with Kinsus to alleviate pressure on its CoWoS (Chip-on-Wafer-on-Substrate) capacity and prevent potential customer shifts to Intel’s packaging platform.
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