Tektronix

News Summary:

On August 5, 2026, Tektronix highlighted high-channel parallel testing as a method to improve semiconductor test throughput, addressing the growing complexity of devices like AI processors, automotive electronics, and analog ICs that require extensive electrical characterization. Previously, on August 3, 2026, the company discussed analysis software designed for modern power distribution, emphasizing its role in addressing challenges like transient currents exceeding 1000 A in AI servers and high-performance compute racks, where voltage droops can introduce jitter or bit errors. Earlier, on July 16, 2026, Technical Marketing Manager Dave Pereles detailed probing considerations for double pulse testing of silicon carbide (SiC) devices and modules, noting the new challenges that emerge when transitioning from silicon IGBT-based power converters to SiC in design and quality assurance. This followed a July 13, 2026, discussion on four innovations aimed at accelerating high channel-count, high-precision semiconductor testing, which focused on increasing throughput and coverage through parallel testing without compromising measurement accuracy or device safety. On July 11, 2026, Tektronix introduced its Power Distribution Network (PDN) Analysis Software for its 4 Series B, 5 Series B, and 6 Series B Mixed Signal Oscilloscopes, which unifies stability, impedance, noise, and jitter analysis into a single workflow.